TR-NY-SBG800 BGA precision rework station


COMPANY : Tryte Technology (H.K.) Limited
ADD : UNIT 04, 7/F, BRIGHT WAY TOWER, NO. 33 MONG KOK ROAD, KOWLOON, HONGKONG.
TEL:00852-2389298
FAX: 00852-35902333
CELL:0086-15367067787(Robin)
SITE : www.trytetc.com
SKYPE : live:myformat666
EMAIL : sale@trytetc.com
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  • Name: TR-NY-SBG800 BGA precision rework station
  • Model : TR-NY-SBG800
  • Erp code: 5000000038
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TR-NY-SBG800.jpg

  1. PLC control, man-machine interface: big screen color LCD screen + touch screen;

  2. Three sections of temperature zone heated independently, the first and second zone can be set 8 sections temperature risen + 8 sections temperature constant control at the same time, a total of 10 groups of temperature curve storage; The third temperature zone uses far infrared heating board for preheating, with independent temperature control, ensuring the PCB to an overall preheating during the welding process and preventing deformation;

  3. The equipment with many sizes of hot air nozzle, or having it made to order according to the special requirements; Hot air nozzle can be under arbitrary rotation 360 degrees, easy to be replaced;

  4. Equipped with adjustable high temperature resistant PCB stents, positioning frame with preventing scalding protection design;

  5. Handheld vacuum pen, sucking BGA, easy for operation, reliable and durable;

  6. The equipment with random hook like heterosexual clip, suitable for motherboard maintenance of different shapes of laptops;

  7. ★Heating head and paste mounted head integration design, with automatic contrapuntal, automatic mounted and automatic welding function;

  8. With computer communication function, built-in PC serial ports, external temperature measurement interface, realizing computer control;

  9. ★Equipped with high definition video contrapuntal system, with spectral amplifier and fine tuning function, with CCD optical contrapuntal function, ensuring accurate BGA device mounted and accurate welding;

  10. Localization mode: V matrix slot PCB positioning, the maximum suitable PCB size 430×400mm;

  11. Chip video magnification: 10-100 times;

  12. Equipped with keeping heat button, more convenient for heating operation control, there is voice alarm function for BGA removing and after the welding;

  13. The upper heating 800 W, lower 800 W, bottom infrared preheated 3000 W;

  14. Power supply: AC220V/5400W;

  15. Overall dimension: 700mm×650mm×800mm;

  16. Weight: 110kg.

  


  1. PLC control, man-machine interface: big screen color LCD screen + touch screen;

  2. Three sections of temperature zone heated independently, the first and second zone can be set 8 sections temperature risen + 8 sections temperature constant control at the same time, a total of 10 groups of temperature curve storage; The third temperature zone uses far infrared heating board for preheating, with independent temperature control, ensuring the PCB to an overall preheating during the welding process and preventing deformation;

  3. The equipment with many sizes of hot air nozzle, or having it made to order according to the special requirements; Hot air nozzle can be under arbitrary rotation 360 degrees, easy to be replaced;

  4. Equipped with adjustable high temperature resistant PCB stents, positioning frame with preventing scalding protection design;

  5. Handheld vacuum pen, sucking BGA, easy for operation, reliable and durable;

  6. The equipment with random hook like heterosexual clip, suitable for motherboard maintenance of different shapes of laptops;

  7. ★Heating head and paste mounted head integration design, with automatic contrapuntal, automatic mounted and automatic welding function;

  8. With computer communication function, built-in PC serial ports, external temperature measurement interface, realizing computer control;

  9. ★Equipped with high definition video contrapuntal system, with spectral amplifier and fine tuning function, with CCD optical contrapuntal function, ensuring accurate BGA device mounted and accurate welding;

  10. Localization mode: V matrix slot PCB positioning, the maximum suitable PCB size 430×400mm;

  11. Chip video magnification: 10-100 times;

  12. Equipped with keeping heat button, more convenient for heating operation control, there is voice alarm function for BGA removing and after the welding;

  13. The upper heating 800 W, lower 800 W, bottom infrared preheated 3000 W;

  14. Power supply: AC220V/5400W;

  15. Overall dimension: 700mm×650mm×800mm;

  16. Weight: 110kg.

  



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